发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
The present invention comprises a first main face (22a) on a surface side of a substrate (21a). An island portion (26) is formed on the first main face (22a) and a semiconductor chip (29), etc. are adhered thereto. The semiconductor chip (29), etc. are sealed in the hollow portion that is constructed by a column portion (23) and a transparent glass plate (36). Then, the column portion (23) and the transparent glass plate (36) are adhered by epoxy resin, or the like. <IMAGE> <IMAGE> |
申请公布号 |
EP1202342(A2) |
申请公布日期 |
2002.05.02 |
申请号 |
EP20010308571 |
申请日期 |
2001.10.08 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
HYODO, HARUO;KIMURA, SHIGEO;TAKANO, YASUHIRO |
分类号 |
H01L23/02;H01L23/055;H01L23/10;H01L23/62 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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