发明名称 HEAT-TREATING DEVICE
摘要 <p>A heat treating device comprising a treating furnace, a gas feeding means for feeding treating gas into the treating furnace, a heating means for producing a predetermined treating temperature in the treating furnace, an ordinary-pressure exhaust system for exhausting the treating furnace with a predetermined exhaust pressure in the vicinity of the atmospheric pressure, an open/close adjustable and pressure adjustable valve installed in the ordinary-pressure exhaust system, a pressure sensor for detecting the exhaust pressure in the ordinary-pressure exhaust system, and a control section for controlling the valve on the basis of the detected pressure provided by the pressure sensor. In the pressure sensor, the surface in contact with exhaust is made of non-metallic corrosion-resistant material. The heat-treating device is capable of attaining stabilized control without requiring introduction of atmosphere or introduction of inert gas, simplified construction of the exhaust system, cost reduction, and freedom from corrosion of the pressure sensor even in a severe corrosive environment, ensuring that stabilized processing can be effected at any time.</p>
申请公布号 WO2002035590(P1) 申请公布日期 2002.05.02
申请号 JP2001009331 申请日期 2001.10.24
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