| 摘要 |
A semiconductor module (20) comprises 25 light-detecting semiconductor devic es (10), for example, connected in a 5.times.5 matrix using a connecting member consisting of 6 conducting lead frames (29); a transparent material (31) in which the semiconductor devices and the connecting member are buried; and negative and positive terminals (33, 34). In the matrix, the semiconductor devices (10) in each column are connected in series and the semiconductor devices (10) in each row are connected in parallel. The semiconductor device (10) has first and second flat sides that are provided with negative and positive electrodes (9a, 9b), respectively.
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