发明名称 |
Electro-mechanical polishing of platinum container structure |
摘要 |
A method of patterning a metal surface by electro-mechanical polishing is disclosed. A metal surface is placed in fluid communication with an abrasive surface of a pad. The two surfaces are moved relative to each other, in acidic fluid which contains abrasive particles. An electrical circuit is formed between the metal surface and abrasive pad and a current is supplied to the circuit. The patterned surface then is processed into a useful feature such as a bottom electrode for a DRAM capacitor.
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申请公布号 |
US2002052126(A1) |
申请公布日期 |
2002.05.02 |
申请号 |
US20010994668 |
申请日期 |
2001.11.28 |
申请人 |
LEE WHONCHEE;MEIKLE SCOTT |
发明人 |
LEE WHONCHEE;MEIKLE SCOTT |
分类号 |
B23H5/08;H01L21/288;H01L21/321;H01L21/3213;(IPC1-7):H01L31/119 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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