Circuit has power stage with heat generating components mounted around component(s) that generates less heat mounted in inner region, conducting metal body mounted on cooling body

摘要

The circuit has a power stage (LE) with heat generating components mounted around at least one component that generates less heat mounted in an inner region. The heat generating components are connected to at least one conducting metal body (K1) that is mounted on a cooling body (KK) in electrically insulated manner to cool the components. The cooling body encloses the inner region.