Silicone-based bonding sheet and semiconductor device

摘要

A silicone-based bonding sheet comprising a sheet of a cross-linked product of a crosslinkable silicone composition, the composition containing a spherical filler having a particle size not greater than the thickness of the sheet and an average particle size of from 50% to 100% relative to the thickness of the sheet. A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site, and a silicon-based bonding sheet interposed between the chip and the attachment site.