发明名称 Method and apparatus for forming pattern onto panel substrate
摘要 A method for forming a pattern on a surface of a panel substrate, includes electrically charging pattern-forming material particles, jetting out the electrically charged pattern-forming material particles through a nozzle by applying electrostatic force to the pattern-forming material particles to form a pattern, and fixing the pattern onto the panel substrate.
申请公布号 US2002050061(A1) 申请公布日期 2002.05.02
申请号 US20010892737 申请日期 2001.06.28
申请人 KOMYOJI DAIDO;MATSUDA NAOKO;FUKANO AKIRA;OGAWA KATSUTOSHI;KUMON AKIRA;NAKA HIROYUKI 发明人 KOMYOJI DAIDO;MATSUDA NAOKO;FUKANO AKIRA;OGAWA KATSUTOSHI;KUMON AKIRA;NAKA HIROYUKI
分类号 H01J9/02;H05K3/10;(IPC1-7):H05K3/02;B05C5/00 主分类号 H01J9/02
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