发明名称 |
Method and apparatus for forming pattern onto panel substrate |
摘要 |
A method for forming a pattern on a surface of a panel substrate, includes electrically charging pattern-forming material particles, jetting out the electrically charged pattern-forming material particles through a nozzle by applying electrostatic force to the pattern-forming material particles to form a pattern, and fixing the pattern onto the panel substrate.
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申请公布号 |
US2002050061(A1) |
申请公布日期 |
2002.05.02 |
申请号 |
US20010892737 |
申请日期 |
2001.06.28 |
申请人 |
KOMYOJI DAIDO;MATSUDA NAOKO;FUKANO AKIRA;OGAWA KATSUTOSHI;KUMON AKIRA;NAKA HIROYUKI |
发明人 |
KOMYOJI DAIDO;MATSUDA NAOKO;FUKANO AKIRA;OGAWA KATSUTOSHI;KUMON AKIRA;NAKA HIROYUKI |
分类号 |
H01J9/02;H05K3/10;(IPC1-7):H05K3/02;B05C5/00 |
主分类号 |
H01J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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