| 摘要 |
<p>In a process for manufacturing a semiconductor device, a film to be worked formed over a wafer is flattened by a treatment for changing the shape of this film before it is worked. A treatment for changing the shape of the film to be worked is exemplified by sheet-fed wet etching. In consideration of the compatibility of the film to be etched with a working means, the film to be etched is, for example, wet-etched so that a part of poor compatibility may be cancelled, thereby improving in advance the in-plane distribution of the film to be worked.</p> |
