| 摘要 |
PURPOSE: To provide a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin useful for electric and electronic fields and the like. CONSTITUTION: The tetramethylbiphenyl type epoxy resin composition is obtained by reacting 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl with epihalohydrin in the presence of an alkali metal compound, and contains 0.5 wt.% or less of tetramethyldiphenoquinone and 0.5 wt.% or less of a glycidyl compound shown by a structural formula 1. The curable epoxy resin composition contains the epoxy resin composition and a curing agent for the epoxy resin. |
