Repairable flip chip semiconductor device, and method of manufacturing same

摘要

Firstly, there are prepared a semiconductor chip 13 with a group of solder bumps disposed on and joined to a surface thereof in a predetermined pattern, and a multilayer plate including a second layer 10 as an electrically-conductive layer and first and third layers 12,12' disposed on respective opposite surfaces of the second layer and comprising metal layers of a metal such as copper. Then, the first layer and the third layer of the multilayer plate are etched (fig 2d) in a predetermined pattern to form a first group of posts 12 and a second group of posts 12' which have a pattern identical to the pattern of the group of solder bumps. Then, the semiconductor chip is positioned to hold the solder bumps in contact with the posts of the first group 12, and the solder bumps are melted to join the solder bumps to the posts of the first group 12. Thereafter, the second layer is cut or otherwise divided between the posts of the first and second groups, producing separate multilayer posts (fig 2g). A resin layer 16 is then formed between the posts. External solder electrodes 18 may be formed to allow easy removal of the chip 13 and posts from a circuit board. The multilayer plate may alternatively be made by etching two copper plates and then soldering them together face-to-face before injecting resin and removing copper to form separated posts. A plurality of multilayer plates may be used.