发明名称 Protecting method applied to the semiconductor manufacturing process
摘要 A method and a structure for protecting a work piece in a semiconductor manufacturing process includes a cassette for mounting therein the work pieces and a sheet piece for shielding the work pieces; and a working platform for mounting thereon said cassette. Furthermore, there is a lid covering the working platform in order to prevent a contaminant from entering the cassette during the semiconductor manufacturing process so that the gate oxide loss of every wafer in the cassette will be reduced.
申请公布号 US6380090(B1) 申请公布日期 2002.04.30
申请号 US19980174143 申请日期 1998.10.16
申请人 WINBOND ELECTRINICS CORP 发明人 SUNG MEI-HUI;TAI SHIH-KUAN
分类号 H01L21/00;H01L21/673;(IPC1-7):H01L21/306 主分类号 H01L21/00
代理机构 代理人
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