发明名称 |
Protecting method applied to the semiconductor manufacturing process |
摘要 |
A method and a structure for protecting a work piece in a semiconductor manufacturing process includes a cassette for mounting therein the work pieces and a sheet piece for shielding the work pieces; and a working platform for mounting thereon said cassette. Furthermore, there is a lid covering the working platform in order to prevent a contaminant from entering the cassette during the semiconductor manufacturing process so that the gate oxide loss of every wafer in the cassette will be reduced.
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申请公布号 |
US6380090(B1) |
申请公布日期 |
2002.04.30 |
申请号 |
US19980174143 |
申请日期 |
1998.10.16 |
申请人 |
WINBOND ELECTRINICS CORP |
发明人 |
SUNG MEI-HUI;TAI SHIH-KUAN |
分类号 |
H01L21/00;H01L21/673;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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