摘要 |
There is provided a molding-condition recovery device which may easily recover the molding condition having been applied in the past, and also permits the storage of the past molding conditions in a memory having small capacity. A reduction in required memory capacity of the modification history storage file is permitted by storing only data of a component subjected to setting modification, among the components of the molding condition, in a modification history storage file. The recovery of the past molding condition is made by replacing all the set values of the presently-applied molding condition or the data in a temporary file stored with all the set values of the first molding condition with data in the modification history storage file in sequence.
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