发明名称 Thermoplastic molding compounds
摘要 Thermoplastic molding materials ofA) from 72 to 88.5% by weight of a thermoplastic styrene or alpha-methylstyrene polymer or copolymer,B) from 10 to 20% by weight of a first graft polymer having an average particle diameter d50 from 400 to 600 nm, having an n-butyl acrylate based rubber-elastic graft core, and a styrene or alpha-methylstyrene (co)polymer graft shell,C) from 1.5 to 8% by weight of a second graft polymer having a bimodal particle size distribution, the average particle diameter d50 being from 25 to 200 nm and from 350 to 550 nm, having a butadiene or isoprene polymer or copolymer based rubber-elastic graft core, and a styrene or alpha-methylstyrene (co)polymer graft shell,D) from 0 to 50% by weight of conventional additives,where the graft polymers B) and C) constitute from 11.5 to 25% by weight of components A), B) and C), and components A) to D) amount to 100% by weight.
申请公布号 US6380306(B1) 申请公布日期 2002.04.30
申请号 US19990269338 申请日期 1999.03.25
申请人 BASF AKTIENGESELLSCHAFT 发明人 ITTEMANN PETER;NEUMANN RAINER;SEIBRING JOACHIM;ROSENAU BERNHARD;KOETTING MANFRED;GINSS CHRISTOPHE;GUENTHERBERG NORBERT;MEYER CHRISTIAN
分类号 C08J5/00;C08L25/04;C08L33/08;C08L33/20;C08L51/00;C08L51/04;C08L55/02;(IPC1-7):C08L9/00 主分类号 C08J5/00
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