| 摘要 |
A package for a semiconductor device and a method for packaging a semiconductor device are disclosed. The semiconductor package uses a tape which allows for the production of packaged semiconductor devices having different contact patterns. The contact pattern is configured to the required pin contact pattern by varying the number and placement of balls on the bottom of the tape. In one embodiment, the tape includes bonding pads and an array of contact pads. Each bonding pad is connected to one of the contact pads, and an opening is disposed in the tape below each contact pad. A semiconductor device is connected to the tape and is electrically connected to the bonding pads. The semiconductor device is then sealed on the top and sides by a plastic top which attaches to the tape. Balls are then selectively attached to the tape such that they electrically connect to select contact pads so as to form a desired contact pattern. Packages having different contact patterns are easily formed by altering the number and position of balls deposited on the tape. Thus, a single tape may be used for forming packaged semiconductor devices having different contact patterns. Thus, significant cost savings is realized since different tapes need not be fabricated for each different contact pattern.
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