发明名称 |
Multi-layer printed-wiring board and process for producing it, and transferring original plate and process for producing it |
摘要 |
A multi-layer printed-wiring board including a substrate having a plurality of wiring pattern layers sequentially transferred thereon, each wiring pattern layer containing an electrically conductive layer and an electrically insulating layer. The wiring pattern layers are attached to the substrate through an electrically insulating layer.
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申请公布号 |
US6378199(B1) |
申请公布日期 |
2002.04.30 |
申请号 |
US19980222988 |
申请日期 |
1998.12.22 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
YOSHINUMA HIROTO;KAWAI KENZABURO;KOBAYASHI SHINICHI |
分类号 |
H05K1/09;H05K3/00;H05K3/14;H05K3/18;H05K3/20;H05K3/22;H05K3/32;H05K3/46;(IPC1-7):H05K3/36 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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