发明名称 Structure for reducing the mutual inductance between two adjacent transmission lines on a substrate
摘要 A structure for reducing the mutual inductance between two adjacent transmission lines on a substrate according to the invention includes a loop-shaped transmission line, at least one transmission line located on each side of the loop-shaped transmission line. One end of the loop-shaped transmission line is connected to bond wire and a diagonal end is connected to a signal output on the substrate. The loop-shaped transmission line has a short side equal to � of the wavelength of an input signal. With such structure, even though the clock frequency of a used CPU is several hundred MHz, the mutual inductance and cross-talk caused by the mutual inductance can be effectively reduced.
申请公布号 US6380818(B1) 申请公布日期 2002.04.30
申请号 US20000542421 申请日期 2000.04.04
申请人 VIA TECHNOLOGIES, INC. 发明人 LEE CHUN-HO DANIEL
分类号 H01P3/08;H05K1/02;(IPC1-7):H01P5/00 主分类号 H01P3/08
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