发明名称 |
Automated well-tie and substrate contact insertion methodology |
摘要 |
A modified flow for ASIC place an route software flow which allows incorporation into the flow, a process for tracking the locations of substrate contacts and well-ties within and outside the boundaries of placed cells and generating required supplemental placements, making possible an efficient use of silicon chip area expended in the adequate placement of substrate contacts and well-ties.
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申请公布号 |
US6380593(B1) |
申请公布日期 |
2002.04.30 |
申请号 |
US19990464665 |
申请日期 |
1999.12.15 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MAXEY JAY;OVENS KEVIN M.;BITTLESTONE CLIVE |
分类号 |
G06F17/50;H01L27/118;(IPC1-7):G06F15/00 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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