发明名称 |
Thin film forming method and apparatus |
摘要 |
A method and an apparatus for forming a thin film are provided to achieve precise control of a film thickness. In a thin film forming apparatus a shutter provided between a target and a substrate is rotated a plurality of times during a film forming process so that a slit of the shutter passes between the target and the substrate a plurality of times. A thin film forming substance thereby arrives at the substrate from the target a plurality of times in an intermittent manner. A thin film having a predetermined thickness is thus formed on the substrate.
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申请公布号 |
US6379747(B1) |
申请公布日期 |
2002.04.30 |
申请号 |
US19980216742 |
申请日期 |
1998.12.21 |
申请人 |
TDK CORPORATION |
发明人 |
SATO JUNICHI |
分类号 |
C23C14/04;C23C14/54;H01F41/18;H01L21/203;H01L21/31;H01L43/12;(IPC1-7):C23C16/00 |
主分类号 |
C23C14/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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