发明名称 Thin film forming method and apparatus
摘要 A method and an apparatus for forming a thin film are provided to achieve precise control of a film thickness. In a thin film forming apparatus a shutter provided between a target and a substrate is rotated a plurality of times during a film forming process so that a slit of the shutter passes between the target and the substrate a plurality of times. A thin film forming substance thereby arrives at the substrate from the target a plurality of times in an intermittent manner. A thin film having a predetermined thickness is thus formed on the substrate.
申请公布号 US6379747(B1) 申请公布日期 2002.04.30
申请号 US19980216742 申请日期 1998.12.21
申请人 TDK CORPORATION 发明人 SATO JUNICHI
分类号 C23C14/04;C23C14/54;H01F41/18;H01L21/203;H01L21/31;H01L43/12;(IPC1-7):C23C16/00 主分类号 C23C14/04
代理机构 代理人
主权项
地址