| 摘要 |
Herein is desclosed a curable resin composition comprising at least one polyol selected from the group consisting of Polyol A, including polybutadiene polyol (Polyol Aa), Polyol B, including polybutadiene polyol (Polyol Ba) and polyester polyol (Polyol Bb), and Polyol C, and at least one polyblock isocyanate selected form the group consisting of polyblock isocyanate (Isocyanate X), including polybutadiene polyblock isocyanate (Isocyanate Xa), which is excellent in warp property, i.e., provides a low shrinkage, upon curing, and the cured products of which are particularly excellent in flexibility and excellent in such properties chemical resistance, heat resistance, electric insulation, bending resistance and adherence, and which is, therefore, suitable for overcoat of flexible circuit.
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