| 摘要 |
A microelectronic substrate including at least one microelectronic die disposed within an opening in a microelectronic substrate core, wherein an encapsulation material is disposed within portions of the opening not occupied by the microelectronic dice, or a plurality microelectronic dice encapsulated without the microelectronic substrate core. Interconnection layers of dielectric materials and conductive traces are then fabricated on the microelectronic die, the encapsulation material, and the microelectronic substrate core (if present) to form the microelectronic substrate. |
