ADHESIVE COMPOSITION, ADHESIVE FILM, INTERCONNECTION SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film which does not adversely affecting the heat resistance and the moisture resistance which are required for so-called interposers such as a glass epoxy substrate and a flexible substrate and, simultaneously, excels in handling properties with reduced tackiness at the B-stage, an interconnection substrate for mounting semiconductors which has this adhesive film, and a semiconductor device obtained by bonding semiconductor chips to the wiring substrate with the use of the adhesive film. SOLUTION: The adhesive composition which is used has an epoxy resin and a crosslinkable high-molecular weight polymer as the essential components, and the crosslinkable high-molecular weight polymer contains a low glass transition temperature (Tg) crosslinkable copolymer having a Tg of from -70 deg.C to lower than -20 deg.C.