发明名称 JOINTING METHOD OF LEAD WIRE AND TERMINAL
摘要 PROBLEM TO BE SOLVED: To firmly joint the lead wire and the terminal by bundling into one unit, without scattering the lead wire that is made of thin wires of conductive body. SOLUTION: The thin wires composing the lead wire is covered by an insulating cover 12 and by separating the insulating cover at the top end of the lead wire 10, with the top end of the thin wires made of, for example, copper being exposed. Then, a solder 16 is fused on the top end of the thin wires 14, of which top end is exposed, and a solder part 18 is formed. Furthermore, a flux 19 is painted on the solder part 18. After that, by holding the solder part 18 in-between by the terminal 22, and by making electrical current flow twice to a pair of electrodes 26, 28, each of the flux 19 and the solder 16 is fused individually, and the terminal 22 and the solder part 18 become jointed.
申请公布号 JP2002124360(A) 申请公布日期 2002.04.26
申请号 JP20000316613 申请日期 2000.10.17
申请人 HONDA MOTOR CO LTD 发明人 MASUDA TSUGIO;UEDA TAKESHI
分类号 B23K1/00;B23K35/26;H01R43/02;H05K3/34;(IPC1-7):H01R43/02 主分类号 B23K1/00
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