SEM-TYPE DEFECT-REVIEWING DEVICE AND METHOD AND INSPECTION SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide an SEM-type defect-reviewing device that automatically classifies defects in continuity fail such as discontinuity and short-circuiting generated in conductor components such as a contact hole buried in a substrate to be inspected such as a semiconductor wafer to categories correlating closely with the causes of the defect. SOLUTION: Potential contrast defects are classified according to the arrangement state of the defect holes, or are classified based on the correlation with a component position in a preprocess by referring to design information. In addition, the cause of defect is estimated.