发明名称 CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit board having the advantage of being able to uniformize the thickness of a plated film, the advantage of being able to accurately make the flip-chip connection of a semiconductor chip and other advantages. SOLUTION: A silver-plated film is formed on the entire surface of a copper pattern formed on the surface of a board 32, the pattern of one part of the copper pattern is characterized in that a solder alloy layer is formed on the silver-plated film on the pattern of the one part and the other pattern of the copper pattern is characterized in that a nickel-gold-plated film, a nickel- palladium-gold-plated film, a nickel-palladium-plated film or a palladium-plated film is formed on the silver-plated film on the other pattern.</p>
申请公布号 JP2002124744(A) 申请公布日期 2002.04.26
申请号 JP20000312170 申请日期 2000.10.12
申请人 EASTERN CO LTD 发明人 HARA KAORU;ARIGA SETSU
分类号 H05K1/09;H01L23/12;H01L23/32;H01L25/065;H01L25/07;H01L25/18;H05K1/11;H05K3/18;H05K3/24;H05K3/34;(IPC1-7):H05K1/09 主分类号 H05K1/09
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