摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board having the advantage of being able to uniformize the thickness of a plated film, the advantage of being able to accurately make the flip-chip connection of a semiconductor chip and other advantages. SOLUTION: A silver-plated film is formed on the entire surface of a copper pattern formed on the surface of a board 32, the pattern of one part of the copper pattern is characterized in that a solder alloy layer is formed on the silver-plated film on the pattern of the one part and the other pattern of the copper pattern is characterized in that a nickel-gold-plated film, a nickel- palladium-gold-plated film, a nickel-palladium-plated film or a palladium-plated film is formed on the silver-plated film on the other pattern.</p> |