| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of difficulty in bonding and fixing reliably and firmly a semiconductor device on a wiring board through a solder material layer of Au-Sn alloy or the like by melting it because Sn in the solder material layer is diffused into a second anti-diffusion layer and therefore the melting point of the solder material layer is risen. SOLUTION: A main conductor layer 4 composed of a contact metal layer 2, a first anti-diffusion layer 3 and Au, a second anti-diffusion layer 5 of Pt and a solder material layer 7 composed of an Sn layer 6 and an alloy of Au-M (M is Sn, Si or Ge) are stacked in sequence to form a wiring conductor layer on the top of an insulating substrate 1.
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