| 摘要 |
PROBLEM TO BE SOLVED: To provide a composite sheet whose conductive part is of low resistance, has high anisotropic conductivity in width direction, and has superior heat resistance, mechanical strength, as well as connection stability with a semiconductor element, when a fibrous filler (A) has conductivity, and of which, even under excessive load, insulation in sheet width and vertical direction will not easily be deteriorated, and moreover, which still shows better thermal conductivity and is effective in coping with the problem of malfunctions due to heat generation at driving of the semiconductor. SOLUTION: The complex sheet includes a fibrous filler (A) having magnetism, a binder (B) hardened with heat and/or light, and either organic fine particles or inorganic fine particles (C), the fibrous filler (A) oriented toward the width direction of the sheet.
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