发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a hot-melt adhesive which has high creep resistance and can adhere to a plurality of materials and can cope with a plurality of coating methods. SOLUTION: A hot-melt adhesive composition comprises a thermoplastic block copolymer having structures of (a) (A1-B1)n1M (n1 is a natural number of >=2; and M is a residue or residual group of a polyfunctional compound to which n1 polymer chains have been bonded) (a coupling agent), (b) A2-(B2-A3)n2 (wherein n2 is a natural number), (c) (B3-A4)n3 (wherein n3 is a natural number of >=2), (d) B4-(A5-B5)n4 (wherein n4 is a natural number), and (e) A6-B6 [provided that A1, A2, A3, A4, A5, and A6 are each a vinyl aromatic hydrocarbon polymer block having a glass transition point (Tg) of >=room temperature; and B1, B2, B3, B4, B5, and B6 are each a butadiene polymer block], a hydrogenated terpene resin which is solid at room temperature, a 5C based hydrogenated resin which is liquid at room temperature, and a plastifying oil.
申请公布号 JP2002121524(A) 申请公布日期 2002.04.26
申请号 JP20000318102 申请日期 2000.10.18
申请人 SEKISUI CHEM CO LTD 发明人 HONDA JUNICHI
分类号 C09J153/02;C09J123/26;C09J191/00;(IPC1-7):C09J153/02 主分类号 C09J153/02
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