发明名称 BONDED STRUCTURE AND BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonded structure using a novel adhesive which strongly bonds to an extent equal to or more than the conventional polychloroprene (CR) solvent based adhesive without any problems in the aspects of safety and hygiene, and atmosphere. SOLUTION: The bonded structure can be obtained by bonding an adherend to a substrate with the use of an adhesive composition comprising a polychloroprene latex obtained by polymerizing 100 pts. mass chloroprene and more than 0 pt. mass to less than 2 pts. mass ethylenically unsaturated carboxylic acid in the presence of 0.5-4 pts. mass polyvinyl alcohol, and then adding a pH adjustor and a radical scavenger to the resulting product and having a gel content of the chloroprene polymer of 10-60 mass% and a pH of 6-9, a tackifying resin, and a metal oxide as the major components in an amount added of the tackifying agent of 10-100 pts. mass (in terms of the solid content) based on 100 pts. mass solid content of the polychloroprene latex.
申请公布号 JP2002121517(A) 申请公布日期 2002.04.26
申请号 JP20000311675 申请日期 2000.10.12
申请人 DENKI KAGAKU KOGYO KK 发明人 YASHIMA HIROYUKI;YAMAGUCHI MIKIO
分类号 B29C65/54;C08F2/30;C08F2/44;C08F279/02;C09J111/02;C09J151/04;C09J201/00;(IPC1-7):C09J111/02 主分类号 B29C65/54
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