| 摘要 |
PROBLEM TO BE SOLVED: To provide pre-setting adhesive which can form a coating film excellent in thickness uniformity without detriment to production efficiency in the present state to thereby decrease the trouble of warp of wafer, etc. SOLUTION: This adhesive is prepared by dissolving a synthetic resin or a natural resin in a solvent, provided that the solvent is a mixture comprising a major amount of methyl ethyl ketone and a minor amount of at least either propylene glycol monomethyl ether or butyl acetate. |
