发明名称 HIGH-FREQUENCY CIRCUIT BOARD, ELECTRONIC PART USING THE SAME, AND ELECTRONIC DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a high-frequency circuit board which is capable of expanding a feasible range of line characteristics, improving a circuit design in degree of freedom, and reducing a dielectric board in size, to provide an electronic part using the same, and an electronic device using the same. SOLUTION: A first ground electrode 4 is formed nearly on all the one primary surface of a dielectric board 3. First dielectric layers 5a, 5b, and 12 lower than the dielectric board 3 in permittivity are formed on the other primary surface of the dielectric board 3. Line electrodes 6a, 6b, and 13 are formed on the other primary surface of the dielectric board 3 and the first dielectric layers 5a, 5b, and 12. The first dielectric layers 5a, 5b, and 12 are set equal to each other in thickness but different from each other in permittivity. Therefore, a high-frequency circuit board enables a circuit design to be improved in degree of freedom, easily carried out, and can be reduced in size and cost.
申请公布号 JP2002124805(A) 申请公布日期 2002.04.26
申请号 JP20000314982 申请日期 2000.10.16
申请人 MURATA MFG CO LTD 发明人 IDA YUTAKA;YAGI YOSHIKAZU;IEGI TSUTOMU
分类号 H05K1/02;H01L23/12;H01P3/08 主分类号 H05K1/02
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