| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost by reducing material loss when dicing a chip. SOLUTION: This method comprises a process of marking scratches 23 at such places on the rear face of a substrate that are away in the [01-1] direction from the predetermined positions on the surface of a wafer by a distance expressed by d×tanθ, where (d) is the thickness of the wafer, and a process of applying bending stress from the surface of the wafer and dicing the wafer into a plurality of chips. |
