发明名称 CONTACT TYPE/NONCONTACT TYPE COMMON IC MODULE AND IC CARD USING IT
摘要 PROBLEM TO BE SOLVED: To solve such problems on how to process printing ink so that no sealing resin leaks from the gap of a sealing frame and how to increase the yield in forming the sealing frame by the screen printing method of an IC module for a two-way access card. SOLUTION: An external device connecting terminal is formed on one side of an IC module substrate, and an IC chip is fixed via an adhesive onto the opposite side to the side where the external device connecting terminal is formed. The terminal of the IC chip and the back side of the external device connecting terminal are electrically connected by a metal wire through a hole bored on the module substrate. A loop-like antenna connecting circuit having two cutoff sections is formed on the outside of the IC chip and the metal wire, and antenna connecting terminals are formed on the outside extensions of individual antenna connecting circuits cut off at two cutoff sections.
申请公布号 JP2002123808(A) 申请公布日期 2002.04.26
申请号 JP20000315755 申请日期 2000.10.16
申请人 DAINIPPON PRINTING CO LTD 发明人 KUSANAGI TSUKASA;OZAKI KATSUMI;AKIYAMA TOMOYA;KON KENJI
分类号 B42D15/10;G06K19/07;G06K19/077 主分类号 B42D15/10
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