| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and equipment for polishing a semiconductor wafer, which allows the search for the optimum values for polishing conditions while continuing the production. SOLUTION: The semiconductor polisher for polishing an interlayer film formed on a semiconductor wafer comprises a polishing means for polishing the interlayer film formed on the semiconductor wafer based on the set polishing conditions, a measuring means for measuring the thickness of the interlayer film formed on the semiconductor wafer polished by the polishing means, and an acquiring means for obtaining polishing conditions for other semiconductor wafers using the measured results of a plurality of semiconductor wafers polished based on different polishing conditions. |
