| 摘要 |
PURPOSE: An electroplating bath for repairing seed layers by filling apertures prior to metallization is provided. CONSTITUTION: The method for providing a metal seed layer substantially free of discontinuities disposed on a substrate comprises the step of contacting a metal seed layer disposed on a substrate with an alkaline copper electroplating bath (pH 8 to 9) comprising copper pyrophosphate and complexing agent, one or more bases selected from ammonium hydroxide or tetra(C1-C4)alkylammonium hydroxide, one or more compounds selected from halides, brighteners, suppressors, levelers, grain refiners, wetting agents or surfactants.
|
