发明名称 PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plating device capable of passing adequate current at good timing after surely recognizing the number of treatment articles arriving at a plating device. SOLUTION: This device has a power source 12 of a treatment stage, a number-of-treatment article detecting section 11 which detects the number of the treatment articles, a serial number specifying section 31 which specifies the serial numbers assigned to the treatment articles, a memory section 34 which stores the information relating to the kinds of the treatment articles and the plating areas in these kinds, an arithmetic section 32 which calculates the plating areas in a treatment stage and calculates the plating current and an automatic current setting section 33 which automatically sets the current and passes this current to the power source described above.
申请公布号 JP2002121700(A) 申请公布日期 2002.04.26
申请号 JP20000311811 申请日期 2000.10.12
申请人 MITSUBISHI ELECTRIC CORP 发明人 MURAKAMI TOMOHIRO
分类号 C25D7/12;C25D21/12;H01L23/50;(IPC1-7):C25D21/12 主分类号 C25D7/12
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