发明名称 LEAD TERMINAL STRUCTURE AND SOLDERING CHECKING METHOD
摘要 PROBLEM TO BE SOLVED: To decide the propriety of a rear side bonding part by visually deciding a front side bonding part in the propriety check of solder bonding of a lead terminal onto a double faced substrate. SOLUTION: By previously providing a front face processing part for blocking solder wetness at the prescribed position of the lead terminal on the rear side of the substrate, a solder sticking quantity according to the area of solder sticking to a land is provided on the rear side. When solder supply to the bonding part is made into prescribed quantity, the solder quantity of a solder fillet (namely, the form of the solder bonding part) on the front side of the substrate is shaped according to the area of solder sticking to the rear side land and the propriety of solder bonding of a through hole on the rear side of the substrate, and the land and the lead terminal can be decided from the form of the solder fillet on the front side of the substrate.
申请公布号 JP2002124761(A) 申请公布日期 2002.04.26
申请号 JP20000313921 申请日期 2000.10.13
申请人 FUJITSU TEN LTD 发明人 UDONO NAOYASU
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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