| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
PROBLEM TO BE SOLVED: To improve the manufacturing yield of a semiconductor device at a low cost. SOLUTION: A first semiconductor chip is electrically connected to a second semiconductor chip which is laminated on the first chip via an internal lead part of a lead disposed on a periphery of the first chip and two bonding wires. |
| 申请公布号 |
JP2002124626(A) |
申请公布日期 |
2002.04.26 |
| 申请号 |
JP20000315785 |
申请日期 |
2000.10.16 |
| 申请人 |
HITACHI LTD;HITACHI HOKKAI SEMICONDUCTOR LTD;HITACHI ULSI SYSTEMS CO LTD |
发明人 |
ISHIDA TORU;URAWA TETSUJI;ITO FUJIO;MATSUZAWA ASAO;SUZUKI KAZUNARI;KAMEOKA AKIHIKO;SUZUKI HIROMICHI;IDE TAKUJI |
| 分类号 |
H01L25/18;H01L23/48;H01L23/495;H01L23/52;H01L25/065;H01L25/07 |
主分类号 |
H01L25/18 |
| 代理机构 |
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