| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad used for polishing a wafer, which allows the user to obtain the thickness of a film being polished without releasing the wafer from the surface plate in the middle of polishing and which can make very precise and efficient control of polishing. SOLUTION: The polishing pad has the center of rotation and is used in a rotating state when polishing a wafer. The polishing pad is provided with a window which is relatively long in the direction toward the center of rotation and is relatively short in the direction vertical to the direction toward the center of rotation. |
