| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the location of parts is limited to increase the cost of a device since packaging is concentrated on the surface of component since the component falls sometimes by the reflow of a component surface when the component of large volume is packaged on the soldered face of a double-faced package board. SOLUTION: Soldered-face packaging components 2 and 3 are packaged on a soldered face 1a of a double-faced package board 1, a soldered face fitting metal 5 is fixed on both the sides of the soldered face 1a by screwing, a pressing plate 6 is fixed from the rear side of the soldered face fitting metal 5 by a stepped screw 7 so as to be in contact with the soldered face packaging component 2, and a component face packaging component 4 is packaged on a component face 1b of the double-faced package board 1 by reflow.
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