发明名称 BONDING METHOD OF DISPLAY BOARD, DISPLAY UNIT AND FIELD- EFFECT DISPLAY UNIT
摘要 PROBLEM TO BE SOLVED: To carry out frit melting while exhausting and heating at the same time. SOLUTION: The board 100' with a display indicating board fixed after alignment consisting of a material with heat absorbency and having an electronic device for display is radiation heated with heater devices 4, 5 in a vacuum chamber 1 being exhausted by a vacuum pump 6, to which the above display board is bonded by frit melting.
申请公布号 JP2002124186(A) 申请公布日期 2002.04.26
申请号 JP20000313633 申请日期 2000.10.13
申请人 SONY CORP 发明人 SAITO TSUNENARI
分类号 H01J9/26;H01J5/02;H01J5/08;H01J5/16;H01J29/86;H01J29/88;H01J29/89;H01J31/12;(IPC1-7):H01J9/26 主分类号 H01J9/26
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