| 摘要 |
PROBLEM TO BE SOLVED: To use a semiconductor device using a lead frame with a metal plate, which is characterized by high radiation, and a semiconductor device using a wiring tape for mounting a semiconductor element, the feature of which is high density, to provide a semiconductor device having advantages of both the semiconductors. SOLUTION: A first semiconductor element 4 is provided on one surface of a metal plate 7 laminated on a lead frame 3 and is allowed to function as a first semiconductor device through a bonding wire 2 and the lead frame 3. Meanwhile, a wiring circuit is formed with a copper foil on one surface of a tape substrate made of an insulating material, and a bonding pad for semiconductor connection is formed on one end portion of this wiring circuit, while a pad for attaching a solder ball is formed on the other end portion. Furthermore, a window hole portion for electrically connecting the semiconductor element, wire bonding and so forth, is formed on a wiring tape 10 for mounting a semiconductor element. A second semiconductor device, having a BGA structure provided with a second semiconductor element 8 below the wiring tape via a semiconductor fixing member 9, is mounted on the other side of the metal plate 7. |
