发明名称 ETCHING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide etching equipment which is capable of uniformizing the treatment over a fine pattern part and reducing the damage and superior in productivity. SOLUTION: A high frequency power pulse compressor for compressing pulses converted from a high frequency power waveform in high frequency discharge, a plasma generator for generating a plasma using a high frequency power pulse-compressed by the pulse compressor, and a discharge electrode for etching with the plasma generated by the plasma generator.
申请公布号 JP2002124509(A) 申请公布日期 2002.04.26
申请号 JP20000314179 申请日期 2000.10.13
申请人 SCI TECHNOL KK 发明人 KUBOTA NAOKI
分类号 C23F4/00;H01L21/302;H01L21/306;H01L21/3065;(IPC1-7):H01L21/306 主分类号 C23F4/00
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