| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin mold wiring board disusing switch parts, enabled to aim at improvement of a freedom of the location of a switch. SOLUTION: A resin mold wiring board is formed by molding at least one pair of wiring frames 1, 1 with resin. End parts 1a, 1a of the pair of wiring frames 1, 1 are made to face each other with a prescribed distance S. Both end parts 1a, 1a are exposed outwards. By the above, a switch part 11, enabled to short-circuit both end parts 1a, 1a by touching a jig 10 having a contact part 9 made of a conductor from the outside, is formed.
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