| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the packaging method of a chip with a bump that does not use any flux and has stable quality and low costs. SOLUTION: In the method for packaging the soldering bump of the chip with the bump by joining to an electrode on a substrate, the substrate is heated in a baking process for removing a gas constituent contained in the substrate. After that the substrate is subjected to plasma treatment for removing a nickel compound and copper oxide that obstruct soldering junction properties on the surface of the electrode, thus securing the soldering junction properties between the soldering bump and electrode without using any flux, at the same time, preventing bubblers from being generated in a sealing resin by removing the gas, and hence achieving the reliable packaging method of the chip with the bump at low costs.</p> |
