发明名称 SPIN TREATING APPARATUS FOR SUBSTRATES
摘要 PROBLEM TO BE SOLVED: To accelerate water drops from moving at the peripheral edge of a substrate to reliably remove the remaining waterdrops from the peripheral edge of the substrate. SOLUTION: Gas is blow on the peripheral edge 5c of a square substrate 5 from a waterdrop scatterer S1, thereby scattering off the waterdrops from the peripheral edge 5c of the substrate 5 due to its gas pressure high enough against the adhesion of the waterdrops remaining on the peripheral edge 5c of the substrate 5.
申请公布号 JP2002124508(A) 申请公布日期 2002.04.26
申请号 JP20000314172 申请日期 2000.10.13
申请人 NEC CORP 发明人 SHIRAISHI YASUSHI
分类号 H01L21/306;H01L21/304;(IPC1-7):H01L21/306 主分类号 H01L21/306
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