| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing equipment which can control the thickness of the central part and that of the peripheral part of a semiconductor wafer to the same polishing profile and can increase the quantity of slurry to be supplied to the surface of the semiconductor wafer. SOLUTION: In this semiconductor manufacturing equipment, the surface 2a of the semiconductor wafer 2 set and held inside an annular retainer ring 1 is pressed against a polishing pad 3, and under this condition, the semiconductor wafer 2 is polished supplying the slurry 8 onto a contact face between the surface 2a of the semiconductor wafer 2 and the polishing pad 3. A slurry supply port 10 is formed in the lower face of the retainer ring 1 close to the inner surface side 1a. |
