| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a low-cost, small and thin piezoelectric device having a semiconductor integrated circuit and a piezoelectric vibrator in a package by which a high-accuracy and stable output frequency can be obtained without generation of high-frequency noise. SOLUTION: The piezoelectric device which has a semiconductor integrated circuit and a piezoelectric vibrator housed in a package formed of a wiring board is a surface mounting type. In a step of its manufacturing, after forming a zero-potential metallized part on the bottom face of the package, the metallized part is connected to an electrode pattern on the ground side by using a connecting means.</p> |
