发明名称 ENERGY RAY CURING HEAT RELEASE ADHESIVE SHEET, AND MANUFACTURING METHOD OF CUT PIECE THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide an energy ray curing heat release adhesive sheet having enough adhesiveness to endure a transfer process such as transportation of an adhered material, causing neither rolling up of the adhesive nor tipping during cutting process, and easy to release and recover the cut pieces after cutting. SOLUTION: This energy ray curing heat release adhesive sheet is laminated at least on one side with an energy ray curing viscoelastic layer and a thermally swelling adhesive layer containing thermally swelling minute spheres, in this order. The energy ray curing viscoelastic layer is composed of i.e., a composition of an organic viscoelastic material and an energy ray curing compound, or an energy ray curing resin. The thickness of the energy ray curing viscoelastic layer is about 5-300μm. The thickness of the thermally swelling adhesive layer may be not more than the maximum diameter of the thermally swelling minute spheres.
申请公布号 JP2002121505(A) 申请公布日期 2002.04.26
申请号 JP20000318644 申请日期 2000.10.18
申请人 NITTO DENKO CORP 发明人 KIUCHI KAZUYUKI;OSHIMA TOSHIYUKI;MURATA SHUTO;ARIMITSU YUKIO
分类号 C09J5/00;C09J7/02;C09J201/00;H01L21/00;(IPC1-7):C09J7/02 主分类号 C09J5/00
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