| 摘要 |
PROBLEM TO BE SOLVED: To easily remove scratches or chips produced by center-less polishing of a cylindrical substrate and to prevent charges from leaking in an OPC(organic photoconductor) drum and a developer carrying body which uses the polished cylindrical substrate. SOLUTION: After the cylindrical substrate 4S is subjected to the surface treatment by center-less polishing of the surface of the cylinder, flaws 5 or chips 6 produced by polishing can be easily removed by wiping off the surface of the cylindrical substrate 4S with a wiping material (e.g. cloth, paper, sponge polishing tape or the like). Then a photosensitive layer is applied on the cylindrical substrate 4S to obtain the OPC drum. A coating material containing conductive fine particles is applied on the cylindrical substrate 4S to obtain the developer carrying body. When the cylindrical substrate 4S is subjected to ultrasonic cleaning before applying the coating material, the substrate is preferably wiped after the ultrasonic cleaning because flaws 5 rise like flaws 7 by the ultrasonic cleaning. |
