| 摘要 |
PROBLEM TO BE SOLVED: To uniformly maintain a resin volume on the top and bottom of a semiconductor chip, without performing depress work on an inner lead to prevent bending of a package upon molding. SOLUTION: In an LOC lead frame having a structure, where a tape 2 for bonding a semiconductor chip 3 is bonded on the end portion of an inner lead 1 of a lead frame, two or more tapes 2 are laminated to obtain a thick structure, so that the position of the semiconductor chip 3 is lowered. |
